SV Thermal Conductive Biyu Bangaren 1: 1 Ginin Potting na lantarki Sealant don Akwatin Junction
Bayanin Samfura
SIFFOFI
1. Low danko, mai kyau fluidity, azumi kumfa dissipation.
2. Kyakkyawan rufin lantarki da zafin zafi.
3. Yana iya zama warai potting ba tare da ƙarni na low kwayoyin abubuwa a lokacin curing, yana da musamman low shrinkage da kyau kwarai adhesion zuwa aka gyara.
KYAUTA
A:B =1:1
Kashi: 25KG
B kashi: 25 KG
AMFANIN GASKIYA
1. Potting da hana ruwa ga LED direban, ballasts, da kuma baya parking na'urori masu auna sigina.
2
ALKUR'ANI MAI GIRMA
Ba a yi nufin waɗannan ƙimar don amfani ba wajen shirya takamaiman bayanai
| DUKIYA | A | B | |
| Kafin Cakuda | Bayyanar | Fari | Baki |
| (25 ℃, 65% RH) | Dankowar jiki | 2500± 500 | 2500± 500 |
| Yawan yawa (25 ℃, g/cm³) | 1.6 ± 0.05 | 1.6 ± 0.05 | |
| Bayan Gauraye | Matsakaicin Rabo (Ta Nauyi) | 1 | 1 |
| (25 ℃, 65% RH) | Launi | Grey | |
| Dankowar jiki | 2500-3500 | ||
| Lokacin Aiki (minti) | 40-60 | ||
| Lokacin Magani (H, 25 ℃) | 3 ~ 4 | ||
| Lokacin Magani (H, 80 ℃) | 10-15 | ||
| Bayan Magani | Hardness (Share A) | 55± 5 | |
| (25 ℃, 65% RH) | Ƙarfin Tensile (Mpa) | ≥1.0 | |
| Ƙarfafa Ƙarfafawa (W/m·k) | 0.6 ~ 0.8 | ||
| Ƙarfin Dielectric (KV/mm) | ≥14 | ||
| Dielectric Constant (1.2MHz) | 2.8-3.3 | ||
| Juyin ƙarar (Ω·cm) | ≥1.0×1015 | ||
| Ƙimar Ƙarfafa Ƙarfafan Layi (m/m·k) | ≤2.2×10-4 | ||
| Yanayin Aiki (℃) | -40-100 | ||
Ku rubuta sakonku anan ku aiko mana
